laptop thermisch ontwerp
Thinness has become the trend of notebook development. From the perspective of heat dissipation, thinness means that the space is further compressed. How to quickly dissipate the internal heat in a narrow space is very important to the performance of notebook computers.
The heat pipe plus fan design is the most common thermal design of notebook computers at present. Its biggest advantage is that the heat of the core components can be quickly transferred to the heat sink through the heat pipe, and then the heat can be forcibly discharged through the fan. Except for some passive cooling (no fan) products with special structure, almost all notebooks adopt this active cooling solution. Moreover, considering that the cooling fan of notebook computer has the technology of automatic intelligent speed regulation, which can automatically adjust the fan speed according to the CPU, GPU temperature or the temperature on the heat sink, such a scheme can also achieve the effect of silence.
Due to the large heating capacity of high-performance processors and graphics cards, entertainment notebooks with better design usually adopt double heat pipes or even four heat pipes, which can transfer the chip heat to the heat sink more quickly, and then forcibly discharge the heat through the fan, so as to effectively reduce the heat accumulation inside the fuselage and improve the touch comfort of users' palms.
Generally, the bottom of the CPU will be coated with a layer of silicone grease to make the CPU better contact with the heat pipe and make the heat export faster.
In addition to the driving of the active fan, the notebook also takes away the heat of the fuselage through the air guide holes opened at the back and bottom of the machine through the flow of cold and hot air. In addition, in combination with the heat dissipation holes, the interior of the notebook computer also adopts some special air duct diversion designs, and uses the position of the heat dissipation holes and the internal structure layout to form a better air circulation environment to strengthen heat dissipation.
Since the keyboard area occupies most of the area on the C side of the notebook, and the motherboard with the largest heat is just below the keyboard area, the keyboard area has different degrees of heat feeling during the operation of the notebook. The bottom of the keyboard can also passively transmit the heat generated by the motherboard. Some thin notebooks use the keyboard for convection heat dissipation. During the knocking and bouncing of the keyboard, the inflow of cold air is completed, and the hot air is discharged through the key hole, which also achieves a certain heat dissipation effect.
Similar to the air duct design of desktop computer, the air duct of notebook should also follow the principle that the wind blows to one place. The air flow should enter on one side and exit on the other side. Of course, no matter how excellent the air duct design is, there is always one place that is particularly hot, that is the location of the heat source.
